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Printed Circuit Board - 20 Layer Interposer 【DSCF5313】

Minimum order quantity starts from 1 piece! Total solution for semiconductor IC test sockets: "20-layer interposer."

The "20-layer interposer" developed by FINPO ELECTRONIC is a total solution for semiconductor IC test sockets, achieving a minimum hole size of 0.3mm, a minimum line width of 2.17mil, and a minimum line spacing of 1.88mil. The minimum order quantity is available from just one piece. For more details, please download the catalog or contact us.